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Light Industrial - Assembler
#27171283
Oldsmar, FL Contract On-Site Flexibility/Remote:
Posted on
We are seeking a highly experienced Solder Assembler with deep expertise in both surface mount technology (SMT) and through hole soldering. The ideal candidate will be proficient in reworking and repairing a wide range of components—including bottom terminated devices such as QFNs, BGAs, and LGAs—using advanced rework equipment and X ray inspection methods. This role supports high mix, low volume production of critical aerospace and defense electronics, requiring meticulous attention to detail and a strong commitment to quality.
• Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards.
• Remove, replace, and re work components, including bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialty rework stations.
• Conduct X ray inspection of re worked bottom terminated parts, evaluate solder joint integrity, and document findings.
• Execute board level verification (visual, AOI, X ray) and functional testing to ensure conformance to specifications.
• Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply "build to print” practices where required.
• Minimum 5 years of handson SMT/TH solder assembly in a highmix, lowvolume environment (aerospace, defense, or similar).
• Additional certification (e.g., IPCA610, IPCJSTD001)
• Ability to sit for extended periods and lift to 25 lb (11 kg).
• Vision acuity (or corrective lenses) sufficient for detailed microscope work.
• Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards.
• Remove, replace, and re work components, including bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialty rework stations.
• Conduct X ray inspection of re worked bottom terminated parts, evaluate solder joint integrity, and document findings.
• Execute board level verification (visual, AOI, X ray) and functional testing to ensure conformance to specifications.
• Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply "build to print” practices where required.
• Minimum 5 years of handson SMT/TH solder assembly in a highmix, lowvolume environment (aerospace, defense, or similar).
• Additional certification (e.g., IPCA610, IPCJSTD001)
• Ability to sit for extended periods and lift to 25 lb (11 kg).
• Vision acuity (or corrective lenses) sufficient for detailed microscope work.